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Thermal Management Products
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Heat sinks and fan/heat sink assemblies to cool processors up to 2.0 GHz including Pentium III and 4, and AMD Athlon up to 1.5 GHz. Socketed processors, Xeon, Flip-chip, and BGA cooling devices. |
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Stamped Heat Sinks in aluminum or solderable tabs; small extruded heat sinks with preinserted solderable pins, and including interface pads. |
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Bonded, folded fin, and extruded heat sinks in extensive variety of standard and custom configurations. |
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Sizes from 25mm to 120mm; 5V to 48V DC input voltages; options for thermal control, tachometer output, and restart; UL, CSA, CE and TUV approval if required. |
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High performance thermal interface materials available from recognized suppliers including
Laird, Bergquist, Chomerics, and Power Devices; thermal resistance from 0.07 to 0.5 °C/W; available with or without adhesive; thermally conductive adhesives in one- or two-part systems. |
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BGA and QFP integrated heat spreaders; wide assortment of retention and attachments in both standard and custom configurations. |
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Heat pipes are a full-custom product. Please click here to fill in an Application Assistance Request Form for assistance. |
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Have a thermal management application for which you don't see a solution?
Fill in our Application Assistance Request Form to receive a call from one of our Sales Engineers who will help you with a custom solution meeting your exacting standards. |
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Download PDF Files |
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Acrobat Reader is a FREE program you can download and use to read PDF files. |
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Technical Papers |
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Download PDF files on various technical issues:
The Basics of Aluminum Extrusions
FAQ on Micro-forged Aluminum Heat Sinks and Spreaders
Copper Heat Sinks vs. Aluminum Heat Sinks - Advantages and Disadvantages
Air Cooled Heat Pipe Assembly
Skived Fin Heat Sinks |
